Rugged Processing AI

GPU Processing at the Edge

Uncompromised data center processing capability deployable anywhere

Evolving compute-intensive AI, SIGINT, autonomous vehicle, Electronic Warfare (EW), radar and sensor fusion applications require data center-class processing capabilities closer to the source of data origin – at the edge. This has driven the need for HPC to evolve into high performance embedded edge computing (HPEEC). Delivering HPEEC capabilities presents challenges as every application has its own survivability, processing, footprint, and security requirements. To address this need, we partner with technology leaders, including NVIDIA, to align technology roadmaps and deliver cutting-edge computing in scalable, field-deployable form-factors that are fully configurable to each unique mission.

What it delivers: HPEEC leverages the latest data center processing and co-processing technologies to accelerate the most demanding workloads in the harshest and most contested environments. Customer benefits include:
· The ability to scale compute applications from the cloud to the edge with rugged embedded subsystems that adhere to open standards and integrate the latest commercial technologies.
· Maximized throughput with contemporary NVIDIA® graphics processing units (GPUs), Intel® Xeon® Scalable server-class processors, contemporary field-programmable gate array (FPGA) accelerators, and high-speed, low-latency networking. 
· Advanced embedded security options that deliver trusted performance and safeguard critical data.

Scaled HPEEC Node
Fig 1. Compose your HPEEC solution with Mercury EnsembleSeries OpenVPX building blocks that include CPU blades powered by Intel Xeon Scalable processors, wideband PCIe switch fabrics and powerful GPU and FPGA co-processing engines that form a truly composable HPEEC architecture. Highly rugged and with built-in BuiltSECURE SSE, these compute solutions are ideally suited to the most hostile and size, weight and size (SWaP) constrained environments characteristic of defense and aerospace applications.

Scaling

We work closely with technology leaders to deliver a composable data center architecture that can be deployed anywhere. As a Preferred Member of the NVIDIA OEM Partner Program our engineering teams leverage their collective capabilities to embed and make secure the latest GPU co-processing resources for defense and aerospace applications. Packaged as rugged OpenVPX modules, these system building blocks are a critical HPEEC scaling element. For even greater interoperability and scalability, these GPU co-processing engines are aligned with the Sensor Open System Architecture (SOSA). In this age of smarter everything, SOSA seeks to place the best technology in the hands of service men and women quicker.

Maximized throughput

Delivering uncompromised data center performance at the edge requires environmental protection. Our proven fifth generation of advanced packaging, cooling and advanced interconnects protect electronics from the harshest environments, keeps them cool for long reliable service lives and enables the fastest switch fabric performance in any environment. The ability to work closely with technology leaders like Intel enables us to package the most general processing capability with hardware enabled AI accelerators as miniaturized OpenVPX blades that form another pillar of a truly composable HPEEC solution (fig 1).

Security

Security has always been important and today it is critical. The closer processing goes to the edge, the more critical this requirement becomes. Proven across tens of defense programs, our embedded BuiltSECURETM technologies counter nation-state reverse engineering with systems security engineering (SSE). BuiltSECURE technology is extensible to deliver system-wide security that evolves over time, building in future proofing. As countermeasures are developed to offset emerging threats, the BuiltSECURE framework keeps pace, maintaining system-wide integrity.

What’s next?

We will soon be announcing an expansion to our portfolio of NVIDIA-powered OpenVPX co-processor engines with the introduction of dual Quadro TU-104 GPU powered configurations. These rugged co-processing engines will feature greater BuiltSECURE capabilities making them exportable as well as enabling them to be deployed anywhere. These options will have NVIDIA’s new NVLinkTM high-speed GPU-to-GPU bus fully implemented to deliver uncompromised data center capability at the edge.

To learn more visit GTC and see Devon Yablonski present “GPU processing at the edge” live – #GTC19

Next-Generation Microelectronics

An Emerging Opportunity in Next-Generation Custom Microelectronics

In September of this year, after a ten-year career in public sector defense industry positions – including serving as the Director for Electronic Warfare at the Department of Defense for almost four years – I switched tracks to the private sector, joining Mercury Systems as Chief Technology Officer. Mercury Systems is revolutionizing the intersection of technology and defense, advancing leading-edge capabilities to a microelectronics industry currently guided by two prevailing themes which together pose immense opportunity.

First, silicon manufacturing and technology are evolving at breakneck speed, which in keeping with Moore’s law have simultaneously driven advancements in computing performance and decreases in cost. To date, this innovation has been most apparent in the high-tech private sector, however there is tremendous opportunity to transfer this innovation over to the public sector and to make it defense-ready. At the same time, however, industry challenges and macro-level geopolitical trends have created an environment in which secure, trusted solutions are an undisputed imperative for U.S. government agencies and defense Primes.

I believe Mercury is uniquely positioned to address these challenges, and this is one of the reasons I joined the Company. Operating in the private sector and with a wealth of experience in electronics from chip level to system level , we have the expertise and ambition to drive real innovation in microelectronics. At the same time, our legacy in servicing the defense community, combined with our Defense Microelectronics Activity-accredited (DMEA) trusted secure manufacturing capabilities, puts us in a unique position as the only commercial industry player capable of serving as an ideal conduit for bringing trusted microelectronics innovation to the public sector.

An Industry at an Inflection Point

We’re excited to be sharing our optimism for the future of public sector microelectronics with the defense community and our peers at the 2019 AUSA Annual Meeting being held this week in Washington, D.C. We’re confident – based on prevailing trends and industry attitudes – that the industry is ripe and eager for change, and we’re excited to share our first step in bringing about that change.

A Bright Future

This week, we announced a $15 million capital investment to bring next-generation trusted commercial silicon technology to the defense community. This initiative represents one of the first commercial applications of the Defense Advanced Research Projects Agency’s (DARPA) Electronics Resurgence Initiative (ERI) and directly aligns with the ERI’s stated goal of “creating a more specialized, secure, and heavily automated electronics industry that serves the needs of both the domestic commercial and defense sectors.”

This announcement and our activities at AUSA’s Annual Meeting set the stage for a bright future in microelectronics for defense applications. We look forward to translating our investment into manufacturing and implementation, and to driving further progress and innovation that matters in microelectronics for the public and private sector.